Page 25 - ERSA

Ersa Dip&Print Station for solder paste printing

The user of an Ersa rework system can prepare components
(application of solder paste or flux) in an easy, reliable and
reproducible manner with the Ersa Dip&Print Station. Solder Paste Printing
Optionally available dip stencils permit – using defined pa-
rameters – to immerse the components into flux or solder
paste, building up a defined depot on the contacts to be sol-
dered. This method is suitable for BGAs and for most fine-
pitch components. Using a component specific print sten-
cil, solder paste depots can be easily and precisely be added
on QFN/MLF pins, for example, and on pins of other SMD
components.
In the printing process, the solder paste is applied from be-
low onto the component fixed in the print stencil. The com-
ponent is then lifted off the stencil with the placement unit
and positioned on the board.
A fitting frame fixation is available for every Ersa rework sys-
tem to install the Dip&Print Station’s stencil frame on the
placement unit.
Component is lifted off the print stencil

Features Dip&Print Station
Easy solder paste printing on the
component
Component dip-in for solder paste
or flux
Fits for every Ersa rework system
Easy stencil exchange
Easy cleaning

Dip&Print Station with accessories Flux application in a dip stencil

Order no. Description

0PR100 Dip&Print Station
0PR100-PL550 Frame fixation for PL 550

0PR100-PL650 Frame fixation for PL 650
0PR100-D001 Dip stencil, 40 x 40 mm / 300 µm

0PR100-D002 Dip stencil, 20 x 20 mm / 150 µm
0PR100-D003 Dip stencil, 20 x 20 mm / 100 µm

Connecting pads of SMD components may have tolerances and significant deviations. Therefore, print stencils can only be offered and produced af-
ter exact technical review.

MLF 32 with solder paste printed on the bottom Dip stencil, 20 x 20 mm, 150 µm Top side of a MLF 32 print stencil
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