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Ersa inspection systems

For nearly fifteen years now, thousands of users worldwide
have been benefiting from the ability to inspect hidden sol-
der joints with the patented and award-winning ERSASCOPE Further solutions
inspection technology.
Industry experts, including the IPC, approve the great impor-
tance of using ERSASCOPE technology for the inspection of
hidden solder joints. In combination with X-ray inspection
equipment, the ERSASCOPE systems provide the most com-
plete view of potential problems in the production process.
ERSASCOPE remains to be the undisputed industry standard
for optically inspecting BGAs and other hidden solder joints!
Whether for inspection under Flip-Chips or for inspection
where other microscopes cannot see, ERSASCOPE technol-
ogy offers a significant added value to any quality assurance
program.

ERSASCOPE M
90° viewing capability with high magnification for the inspection of all common
types of components

ERSASCOPE series

“Best in class” optical inspection technology for in-
spection of hidden solder joints.
The award-winning and patented original ERSASCOPE tech-
nology has been further developed in order to meet to-
day’s challenges of lead-free soldering and low-profile
components.
ERSASCOPE M and M plus are versatile inspection video mi-
croscopes for the analysis of hidden solder joints in electron-
ics production. Both devices are designed for optical inspec-
tion and digital image acquisition – including measurement ERSASCOPE M plus
of BGA solder joints and many other SMT components. Their Powerful external LED light source including gooseneck light guide for an optimal
field of application ranges from the visual inspection of com- inspection of low-profile components such as Flip Chips, µBGAs and CSPs
ponents on PCBs in SMT or THT assembly technology to the
visual inspection of printed circuit board surfaces or solder
paste prints. The devices are suitable for use in quality assur-
ance, production, laboratory, research and development.

Ersa MOBILE SCOPE

The Ersa MOBILE SCOPE is a compact and handy, portable
video microscope to inspect solder joints in electronic pro-
duction environments. It has been designed for optical in-
spection and digital image recording including measurements
of solder joints on Ball Grid Array (BGA), µBGA, CSP and Flip-
Chip packages.
The Ersa MOBILE SCOPE is also suitable to inspect PCB lands
and solder paste prints or for the optical inspection of com-
ponents on printed circuit boards in Surface Mount Technol- MOBILE SCOPE
ogy (SMT) or in Trough Hole Technology (THT) in general. Its
application fields are in quality control, production, laborato- Mobile optical inspection system
ries or R&D departments.

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